Plasma Batch PEALD

Tags:

Advanced Optical/Passivation/Dielectric Films Deposition System

Throughput +50%, Uniformity +30%, Yield improvement

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Product Description

1. Batch-process multi-chamber design significantly increases throughput while dramatically reducing ALD production costs

2. Industry-leading coating uniformity, repeatability, and reliability

3. Enables conformal deposition on entire lens surfaces and 3D micro/nano structures

Specification

12-inch wafer Ru film thickness non-uniformity	<1%
Batch-to-batch Ru film thickness non-uniformity	<1%
Reflectance (R) at visible spectrum	< 0.1%
Film thickness accuracy of the AR coating	0.1 nm

Application

1. Advanced Optical Films (AR)

2. Third Generation Semiconductors

3. Integrated circuit manufacturing

Related FAQs

Is this system capable of depositing AR (anti-reflective) coatings?

The system achieves ultra-low reflectivity AR coatings with reflectance <0.05% across the visible spectrum.

How does the film coating perform in reliability testing?

1. Post-coating inspection: Clean appearance, free from bubbles and contamination; 2. After surface pretreatment: Maintains flawless appearance with no bubbles or stains; 3. Thermal shock resistance: No blistering, delamination or cracking observed; 4. Extended reliability: Passes 1000-hour DH test (85°C/85%RH) with no blistering, delamination or cracking

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