English
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The upgraded equipment adopts an exclusive design for double‑sided coating, enabling simultaneous and uniform deposition on both sides of the sample without the need for secondary flipping. This greatly improves production efficiency and film uniformity.
The upgraded equipment adopts an exclusive design for double‑sided coating, enabling simultaneous and uniform deposition on both sides of the sample without the need for secondary flipping. This greatly improves production efficiency and film uniformity, making it suitable for high‑end applications with strict requirements on double‑sided film performance.
It is also equipped with a fully automatic wafer handling system, realizing unmanned sample transfer throughout the process. This not only enhances operational efficiency but also fundamentally eliminates contamination risks caused by manual handling.
Product Description
Specification
Application
TiN Deposition for Superconducting TSV (Through-Silicon Via)
Superconducting Quantum Chip
High-End RF Devices
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