English
English
Tags:
Optics
Metallic Materials
Superconducting Materials
Semiconductor
Metallic Materials
The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials.
Product Description
1. The system includes one load-lock chamber and multiple sputtering chambers.
2. Load-lock chamber is equipped with ion milling, RF plasma cleaning, gas passivation.
3. Equipped with fully automatic operation interface.
Specification
| Sample Size | Max 12 inch Wafer and smaller chips compatible |
| Magnetron Cathode | 4-6 inch Ultra High Vacuum Magnetron Cathode |
| Power Supply | 1000W DC POWER |
| Ultimate Pressure | ≤3E-9 Torr |
| Process Temperature | 0-900°C |
| Uniformity | Sheet Resistance Uniformity 1 Sigma NU%<±5% (8 inch wafer with 5 mm removal from the edge) |
Application
1. Optics
2. Semiconductors
3. Metallic materials
4. Alloy materials
5. Superconducting materials
Related FAQs
RELATED PRODUCTS
It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising Process Chamber, motion control system and load/unload platform. This system meets the critical requirements for dielectric encapsulation coating on both patterned and planar sapphire substrates in micro/nano-device fabrication.
Learn More
This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.
Learn More
It is the world's smallest atomic layer deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.
Learn More
The system can deposit high-quality thin films such as SiO2, Al2O3, and TiO2 on substrates made of glass, organic materials, polymers, metals, or ceramics.
Learn More
Multi-Chamber UHV Magnetron Sputter
The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials.
Learn More
It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.
Learn More
—Material fabrication：
Niobium, Niobium Nitride, Tantalum, Aluminum, Alloy metal, ITO film
—Multilayer structure fabrication：
1. Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions
2. Compatible with Seed Layer Based Process