English
English
Tags:
Mini/Micro LED
Microelectronics
VCSEL
Automotive Chip
It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.
Product Description
1. Increases throughput while reducing COO
2. Scalable modular design maintains coating quality when expanding capacity/chambers
3. Unique gas flow design achieves:Within-wafer (WIW) non-uniformity <1.5%, Wafer-to-wafer (W2W) <2.5%, Batch-to-batch (B2B) <2.5%
4. Exclusive exhaust treatment system extends vacuum pump maintenance cycles, reducing costs
Specification
| XPS O/Al ratio | >1.40 |
| Breaking Voltage | >7.0 |
| Film density | 2.99 g/cm³ |
| Uniformity | ≤1.5% |
| Process chamber temperature limit | ≤ 250° |
Application
1. MiniLED
2. MicroLED
3. VCSEL
4. Microelectronics
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