English
English
Tags:
Mini/Micro LED
Microelectronics
VCSEL
Automotive Chip
ZLD Technology’s Thermal Batch ALD system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.
It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.
Product Description
ZLD Thermal Batch ALD delivers precise, conformal thin-film deposition with excellent uniformity, capable of handling complex, high-aspect-ratio structures. Its batch processing design enables efficient industrial-scale production, while multiple independently controlled precursor sources allow flexible material deposition for various applications.
1. Increases throughput while reducing COO
2. Scalable modular design maintains coating quality when expanding capacity/chambers
3. Unique gas flow design achieves:Within-wafer (WIW) non-uniformity <1.5%, Wafer-to-wafer (W2W) <2.5%, Batch-to-batch (B2B) <2.5%
4. Exclusive exhaust treatment system extends vacuum pump maintenance cycles, reducing costs
1. Oxides: Al₂O₃, HfO₂, SiO₂, TiO₂, Ta₂O₅
2. Nitrides: AlN, SiN
3. Metals and other materials: Pt, ZnO, AZO, and more
1. High thin-film uniformity and conformality on complex structures
2. Flexible precursor delivery for a wide variety of materials
3. Scalable batch processing suitable for industrial production
4. Capable of depositing oxides, nitrides, metals, and functional films
Specification
| XPS O/Al ratio | >1.40 |
| Breaking Voltage | >7.0 |
| Film density | 2.99 g/cm³ |
| Uniformity | ≤1.5% |
| Process chamber temperature limit | ≤ 250° |
Application
1. MiniLED
2. MicroLED
3. VCSEL
4. Microelectronics
Related FAQs
RELATED PRODUCTS
PEALD realises low temperature, high quality plasma-enhanced ALD processes for high-quality thin film deposition (e.g., SiO₂, Al₂O₃, TiO₂) on various substrates, including lens, glass, organic materials, polymers, metals, and ceramics.
Learn More
This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.
Learn More
Multi-Chamber UHV Magnetron Sputter
The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials. It supports Magnetron Sputtering for ITO Film and Seed Layer Based Process.
Learn More
It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.
Learn More
It is the world's smallest Atomic Layer Deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.
Learn More
ZLD Technology’s Thermal Batch ALD system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.
Learn More
Designed to meet the requirements for graphical and planar sapphire substrate micro-nano device oxidation layer packaging and coating
Ultra-high aspect ratio: Max 100:1