ZLD-DT-6 Desktop ALD ZLD-PW-1000 Powder ALD ZLD-DP-6 Double-sided coated PEALD

ZLD-DT-6 Desktop ALD

Tags:

1. The smallest desktop ALD for R&D, weighing just 50 kg

2. The most widely used applications: Semiconductor, High-K dielectrics, Nanocatalyst, Perovskite, Nanomaterials

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Product Description

ZLD-DT-6 Desktop ALD System by ZLD Technology is a compact, high-precision Atomic Layer Deposition Equipment designed specifically for R&D applications. Engineered with advanced ALD technology, this desktop system offers researchers full control over deposition parameters while maintaining excellent film uniformity and repeatability. Ideal for universities, laboratories, and materials research centers, it enables efficient thin-film coating on wafers and smaller chips — making it an essential tool for innovation in nanotechnology, semiconductors, and energy materials.

Advantages:

1. Compact, quiet, user-friendly

2. Uniform and controllable ALD

3. Sample loading of 4/6 Inch or gram-level powder

4. Full automated human-machine operation interface

5. 4 sets of quick-release precursor modules, wafer drawer loading

6. Optimal R&D solution for advanced energy materials and novel nanomaterials

Material Compatibility:

Oxides: Al₂O₃, SiO₂, TiO₂, ZnO, ZrO₂, HfO₂, Ta₂O₅, MgO, etc.

Nitrides: AlN, TiN, ZrN, HfN, WN

Metals: Ru, Pd, Pt, Ni, Co, W

Sulfides: MoS₂, WS₂, ZnS, TiS₂

Applied in TEM Sample:

TEM Sample Decoration: Desktop ALD can create a clear boundary for TEM imaging via high quality atomically ultra thin coating,develop high Z-contrast coating for TEM imaging, and grow conform 3D authentic decoration coating at low temperature 40-80°C.

Specification

Dimension(L x W x H)	590 x 470 x 470 (mm)
Weight	50KG
Power Supply	220VAC 50HZ rating：1.5kW/7A，Peak power 2.2kW/10A
Sample Size	Up to 6 inch wafer and smaller chips compatible；Sample height≤3mm
Ultimate Vacuum	≤50 mTorr
Process Temperature	RT 360°C
Precursor temperature	Maximum 180°C
Coating Uniformity	Standard process：Aluminum oxide uniformity≤1% Film thickness：30nm
Step Coverage	Deposit on all surfaces with high aspect ratio
Sample Handling	Wafers require careful support; powders may require holders or trays to ensure uniform exposure and prevent contamination or aggregation

Application

1. Energy material

2. Nanomaterials

3. Semiconductors

4. Sensors

Related FAQs

What are features and highlights of ZLD-DT-6？

It features a high level of integration, with only the size of an oven, making it compact and space-saving. It supports a wide range of processes and can fabricate materials such as HfO₂, ZnO, Al₂O₃, and TiO₂.

What is the maximum wafer size that ZLD-DT-6 can produce？

ZLD-DT-6 is a monolithic (single-wafer) research equipment capable of accommodating standard 6-inch wafers at maximum, and can also process small quantities of powdered samples (3g).

What are the applications of ZLD-DT-6?

Semiconductor field: High-K dielectrics, supercapacitors, diodes, etc.; Nanocatalyst field: Photocatalysis, electrochemical catalysis; Perovskite solar cells.

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