4 Chamber UHV Evaporator

4 Chamber UHV Evaporator

This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.

Desktop ALD

It is the world's smallest Atomic Layer Deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.

Multi-Chamber UHV Magnetron Sputter

The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials. It supports Magnetron Sputtering for ITO Film and Seed Layer Based Process.

Powder ALD

It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.

Double-sided coated PEALD

The upgraded equipment adopts an exclusive design for double‑sided coating, enabling simultaneous and uniform deposition on both sides of the sample without the need for secondary flipping. This greatly improves production efficiency and film uniformity, making it suitable for high‑end applications with strict requirements on double‑sided film performance.It is also equipped with a fully automatic wafer handling system, realizing unmanned sample transfer throughout the process. This not only enhances operational efficiency but also fundamentally eliminates contamination risks caused by manual handling.

Thermal Batch ALD

ZLD Technology’s Thermal Batch ALD system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.

Plasma Batch PEALD

PEALD realises low temperature, high quality plasma-enhanced ALD processes for high-quality thin film deposition (e.g., SiO₂, Al₂O₃, TiO₂) on various substrates, including lens, glass, organic materials, polymers, metals, and ceramics.