English
English
Tags:
Optics
Josephson-junction fabrication
Semiconductor
Ion Milling
Oxidation
ZLD-CL-4DT includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.
Product Description
ZLD-CL-4DT is a high-precision ultra-high vacuum thin film deposition system, specifically designed for the fabrication of semiconductors, optical devices, and advanced components. It is specifically optimized evaporation deposition for Josephson junction fabrication, superconducting materials research, and other cutting-edge devices in advanced materials R&D.
Specification
| Sample Size | Max 8 inch Wafer and smaller chips compatible |
| Wafer Heating | RT-900ºC or Liquid nitrogen cooled |
| Ion Milling | Kaufman ion source, sizes upon request |
| E-beam Evaporation | UHV Linear Evaporation Source, 8KW Power Supply (upon request) |
| Oxidation | Multi-level oxidation process with shower head design |
| Uniformity | Sheet Resistance Uniformity 1 Sigma NU%<±2% (8 inch wafer with 5 mm removal from the edge) |
| Load lock chamber base pressure | ≤5E-9 Torr |
| lon Milling chamber base pressure | ≤9E-10 Torr |
| Ebeam Evaporation chamber base pressure | <9E-10 Torr |
Application
1. Josephson-junction fabrication
2. semiconductor
3. Optics
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Advanced solution to tunneling junction, optical structure,
metal-insulator-metal structure, capacitor and so on.