CLASSIFICATION

4 Chamber UHV Evaporator

Tags:

Optics

Josephson-junction fabrication

Semiconductor

Ion Milling

Oxidation

This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.

Advanced solution to tunneling junction, optical structure, 

metal-insulator-metal structure, capacitor and so on.

Share:

Product Description

 1.  It includes 4 process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. 

 2.  Fully automatic operation guarantee reproducible results. 



Specification

Sample Size Max 8 inch Wafer and smaller chips compatible
Wafer Heating RT-900ºC or Liquid nitrogen cooled
Ion Milling Kaufman ion source,  sizes upon request
E-beam Evaporation UHV Linear Evaporation Source, 8KW Power Supply (upon request)
Oxidation Multi-level oxidation process with shower head design
Uniformity Sheet Resistance Uniformity 1 Sigma NU%<±2% (8 inch wafer with 5 mm removal from the edge)
Load lock chamber base pressure≤5E-9 Torr
lon Milling chamber base pressure≤9E-10 Torr
Ebeam Evaporation chamber base pressure<9E-10 Torr



Application

 1.  Josephson-junction fabrication

 2.  semiconductor

 3.  Optics

Related FAQs

What is the maximum heating temperature of this equipment?

RT-900℃

4 Chamber UHV Evaporator

RELATED PRODUCTS

Plasma Batch PEALD

Plasma Batch PEALD

The system can deposit high-quality thin films such as SiO2, Al2O3, and TiO2 on substrates made of glass, organic materials, polymers, metals, or ceramics.

Learn More
Powder ALD

Powder ALD

It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.

Learn More
Thermal Batch ALD

Thermal Batch ALD

It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising Process Chamber, motion control system and load/unload platform. This system meets the critical requirements for dielectric encapsulation coating on both patterned and planar sapphire substrates in micro/nano-device fabrication. 

Learn More
4 Chamber UHV Evaporator

4 Chamber UHV Evaporator

This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.

Learn More
Desktop ALD

Desktop ALD

It is the world's smallest atomic layer deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.

Learn More
Multi-Chamber UHV Magnetron Sputter

Multi-Chamber UHV Magnetron Sputter

The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials. 

Learn More
Contact Us