CLASSIFICATION

Powder ALD

Tags:

Magnetic Materials

Lithium-ion batteries

Ternary Materials (NCM)

Solid-State Batteries

Catalysts

ZLD Technology’s Powder ALD Tool is specifically designed for powder material surface engineering. This high-precision Atomic Layer Deposition (ALD) system enables highly uniform powder coating on micro- and nanoscale powders.

Featuring patented powder containers and a dynamic powder fluidization mechanism, the tool supports automatic temperature control and precise process settings, ensuring controllable coating thickness and excellent uniformity. Whether applied to battery materials, catalysts, metal powders, or advanced nanomaterials, this system empowers research institutions and high-end laboratories to perform atomic layer deposition experiments, driving material innovation and process breakthroughs.

It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.

Designed for R&D and Widely Used in:

1.Battery Applications: Enhances battery performance 

2.Catalysis Applications: High-efficiency catalysts

3.Metal Powder Processing: Improves powder flowability 

4.Advanced Materials Development


Share:

Product Description

 1.  Customizable for batch & scalable production

 2.  Proprietary nano-ALD ensures uniform, high-coverage coating

 3.  Complete coating for ultra-high surface area materials


Specification

Sample Capacity100g/1000g (customizable)
Reaction Temperature RT-300°C
Precursor Heating RT-200°C
Coating Non-uniformity <3%
Ozone GeneratorOptional Configuration, Production Efficiency: 15 g/h
Deposition Rate1-2Å/Cycle (AI2O3)



Application

 1.  Lithium-ion batteries

 2.  Metallic powders

 3.  Alloy powders

 4.  Catalysts

Related FAQs

What are the advantages of ALD coating compared to traditional methods like solution-phase processes?

ALD addresses the critical limitations of traditional solution-phase and solid-phase coating methods—such as poor uniformity, uncontrolled thickness, and substrate damage—through atomic-level precision, strong interfacial bonding, mild processing conditions, and exceptional conformity on complex structures.

What types of thin films can Powder ALD primarily deposit?

Oxides:Al2O3、ZnO2、HfO2、TiO2、SiO2、SnO2 etc.;Phosphates & Lithium Compounds:TiPO4、AlPO4、LiNbO3、LixTiyOz, etc.;Metals: Cu、Pt、W thin films,etc.

What is the maximum powder processing capacity of ZLD Powder ALD?

1000g

What are the advantages?

1.Enhances battery performance 2.Synthesis of highly efficient catalysts 3.Improves powder flowability and handling 4.Nanomaterial surface functionalization 5.Modifies powder characteristics for better compressibility

Powder ALD

RELATED PRODUCTS

Powder ALD

Powder ALD

ZLD Technology’s Powder ALD Tool is specifically designed for powder material surface engineering. This high-precision Atomic Layer Deposition (ALD) system enables highly uniform powder coating on micro- and nanoscale powders.Featuring patented powder containers and a dynamic powder fluidization mechanism, the tool supports automatic temperature control and precise process settings, ensuring controllable coating thickness and excellent uniformity. Whether applied to battery materials, catalysts, metal powders, or advanced nanomaterials, this system empowers research institutions and high-end laboratories to perform atomic layer deposition experiments, driving material innovation and process breakthroughs.It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.

Learn More
Plasma Batch PEALD

Plasma Batch PEALD

The system can deposit high-quality thin films such as SiO2, Al2O3, and TiO2 on substrates made of glass, organic materials, polymers, metals, or ceramics.

Learn More
Desktop ALD

Desktop ALD

The Desktop ALD System by ZLD Technology is a compact, high-precision Atomic Layer Deposition Equipment designed specifically for R&D applications. Engineered with advanced ALD technology, this benchtop system offers researchers full control over deposition parameters while maintaining excellent film uniformity and repeatability. Ideal for universities, laboratories, and materials research centers, the Desktop ALD System enables efficient thin-film coating on wafers, substrates, and small components — making it an essential tool for innovation in nanotechnology, semiconductors, and energy materials.It is the world's smallest atomic layer deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.

Learn More
Thermal Batch ALD

Thermal Batch ALD

It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.

Learn More
Multi-Chamber UHV Magnetron Sputter

Multi-Chamber UHV Magnetron Sputter

The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials. 

Learn More
4 Chamber UHV Evaporator

4 Chamber UHV Evaporator

This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.

Learn More
Contact Us
Home Tel E-mail