Desktop ALD

4 Chamber UHV Evaporator

ZLD Technology’s 4-Chamber UHV Evaporator is a high-precision ultra-high vacuum thin film deposition system, specifically designed for the fabrication of semiconductors, optical devices, and advanced components.This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.

Desktop ALD

The Desktop ALD System by ZLD Technology is a compact, high-precision Atomic Layer Deposition Equipment designed specifically for R&D applications. Engineered with advanced ALD technology, this benchtop system offers researchers full control over deposition parameters while maintaining excellent film uniformity and repeatability. Ideal for universities, laboratories, and materials research centers, the Desktop ALD System enables efficient thin-film coating on wafers, substrates, and small components — making it an essential tool for innovation in nanotechnology, semiconductors, and energy materials.It is the world's smallest atomic layer deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.

Thermal Batch ALD

ZLD Technology’s Thermal Batch ALD system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.

Plasma Batch PEALD

ZLD Technology’s Plasma Batch PEALD system leverages advanced Plasma Enhanced ALD technology to deliver high‑precision thin film deposition for industrial applications. Designed for large‑scale production, this system features a multi‑chamber batch process that significantly increases throughput while reducing production costs. Achieving ultra‑low reflectivity anti‑reflective (AR) coatings with reflectance as low as <0.05% across the visible spectrum, it ensures exceptional uniformity and repeatability. Ideal for applications in optics, third‑generation semiconductors, and integrated circuit manufacturing, the Plasma Batch PEALD system provides reliable and high‑quality thin films on substrates such as glass, polymers, metals, and ceramics.The system can deposit high-quality thin films such as SiO2, Al2O3, and TiO2 on substrates made of glass, organic materials, polymers, metals, or ceramics.

Powder ALD

ZLD Technology’s Powder ALD Tool is specifically designed for powder material surface engineering. This high-precision Atomic Layer Deposition (ALD) system enables highly uniform powder coating on micro- and nanoscale powders.Featuring patented powder containers and a dynamic powder fluidization mechanism, the tool supports automatic temperature control and precise process settings, ensuring controllable coating thickness and excellent uniformity. Whether applied to battery materials, catalysts, metal powders, or advanced nanomaterials, this system empowers research institutions and high-end laboratories to perform atomic layer deposition experiments, driving material innovation and process breakthroughs.It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.

Multi-Chamber UHV Magnetron Sputter

The Multi-Chamber UHV Magnetron Sputter system from ZLD Technology is engineered for high-precision thin film deposition in ultra-clean environments. With capabilities including processing temperatures up to 900°C and ultimate pressures as low as ≤3E-9 Torr, this system is ideal for applications in optics, semiconductors, and superconducting materials. Its advanced features ensure uniform film quality and reproducibility, making it a reliable choice for cutting-edge research and development. The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials.The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials.