English
English
Tags:
Optics
Metallic Materials
Superconducting Materials
Semiconductor
Metallic Materials
Product Description
It supports Magnetron Sputtering for ITO Film and Seed Layer Based Process.
1. The system includes one load-lock chamber and multiple sputtering chambers.
2. Load-lock chamber is equipped with ion milling, RF plasma cleaning, gas passivation.
3. Equipped with fully automatic operation interface.
Ion Bombardment: Plasma ions accelerate toward a target, dislodging atoms by momentum transfer.
Magnetic Confinement: Magnetic fields trap electrons near the target, increasing plasma density and reducing ionization losses.
Reactive Sputtering: Introduction of reactive gases (e.g., O₂, N₂) allows for compound film deposition (oxides, nitrides).
Thermal Efficiency: The target remains relatively cool, which supports deposition of high-melting-point materials without excessive heating.
The system supports multiple UHV sputtering chambers plus a load-lock chamber for efficient sample loading.
Base pressure can reach ≤ 3 E-9 Torr, enabling ultra-clean film growth.
Process temperature range spans from room temperature up to 900 °C, enabling thermal processing or elevated-temperature depositions.
Modular chamber architecture supports multi-layer structures, such as Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions.
Wafer Transfer: Highly reliable and repeatable substrate transferring capability
Uniformity: Sheet Resistance Uniformity 1 Sigma NU%<±5% (4 inch wafer with 5 mm removal from the edge)
Power Options: DC or RF power supply
Source Flexibility: It is compatible with different sputtering sources and reactive gas feed, allowing customization of material composition.
Fully automated control interface enables precise management of process parameters.
Real-time monitoring (e.g., thickness, rate) can be implemented via in-situ tools.
Substrate heating and biasing help tune film microstructure and uniformity.
Specification
| Sample Size | Max 12 inch Wafer and smaller chips compatible |
| Magnetron Cathode | 4-6 inch Ultra High Vacuum Magnetron Cathode |
| Power Supply | 1000W DC POWER |
| Ultimate Pressure | ≤3E-9 Torr |
| Process Temperature | 0-900°C |
| Uniformity | Sheet Resistance Uniformity 1 Sigma NU%<±5% (8 inch wafer with 5 mm removal from the edge) |
Application
1. Optics
2. Semiconductors
3. Metallic materials
4. Alloy materials
5. Superconducting materials
Related FAQs
RELATED PRODUCTS
ZLD Technology’s Powder ALD Tool is specifically designed for powder material surface engineering. This high-precision Atomic Layer Deposition (ALD) system enables highly uniform powder coating on micro- and nanoscale powders.Featuring patented powder containers and a dynamic powder fluidization mechanism, the tool supports automatic temperature control and precise process settings, ensuring controllable coating thickness and excellent uniformity. Whether applied to battery materials, catalysts, metal powders, or advanced nanomaterials, this system empowers research institutions and high-end laboratories to perform atomic layer deposition experiments, driving material innovation and process breakthroughs.It enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.
Learn More
ZLD Technology’s Thermal Batch ALD system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.
Learn More
ZLD Technology’s 4-Chamber UHV Evaporator is a high-precision ultra-high vacuum thin film deposition system, specifically designed for the fabrication of semiconductors, optical devices, and advanced components.This system includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.
Learn More
The Desktop ALD System by ZLD Technology is a compact, high-precision Atomic Layer Deposition Equipment designed specifically for R&D applications. Engineered with advanced ALD technology, this benchtop system offers researchers full control over deposition parameters while maintaining excellent film uniformity and repeatability. Ideal for universities, laboratories, and materials research centers, the Desktop ALD System enables efficient thin-film coating on wafers, substrates, and small components — making it an essential tool for innovation in nanotechnology, semiconductors, and energy materials.It is the world's smallest atomic layer deposition equipment for university, laboratory, which can realize controllable atomic layer deposition on 4/6-inch wafers and micro and nanopowders in high uniformity. It is the the best solution to research and application of advanced energy materials and new nanomaterials.
Learn More
ZLD Technology’s Plasma Batch PEALD system leverages advanced Plasma Enhanced ALD technology to deliver high‑precision thin film deposition for industrial applications. Designed for large‑scale production, this system features a multi‑chamber batch process that significantly increases throughput while reducing production costs. Achieving ultra‑low reflectivity anti‑reflective (AR) coatings with reflectance as low as <0.05% across the visible spectrum, it ensures exceptional uniformity and repeatability. Ideal for applications in optics, third‑generation semiconductors, and integrated circuit manufacturing, the Plasma Batch PEALD system provides reliable and high‑quality thin films on substrates such as glass, polymers, metals, and ceramics.The system can deposit high-quality thin films such as SiO2, Al2O3, and TiO2 on substrates made of glass, organic materials, polymers, metals, or ceramics.
Learn More
Multi-Chamber UHV Magnetron Sputter
The Multi-Chamber UHV Magnetron Sputter system from ZLD Technology is engineered for high-precision thin film deposition in ultra-clean environments. With capabilities including processing temperatures up to 900°C and ultimate pressures as low as ≤3E-9 Torr, this system is ideal for applications in optics, semiconductors, and superconducting materials. Its advanced features ensure uniform film quality and reproducibility, making it a reliable choice for cutting-edge research and development. The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials.The system can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials.
Learn More
—Material fabrication：
Niobium, Niobium Nitride, Tantalum, Aluminum, Alloy metal, ITO film
—Multilayer structure fabrication：
1. Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions
2. Compatible with Seed Layer Based Process