English
English
Tags:
Industrial SiC Epitaxy CVD
SiC Epitaxy Equipment / SiC Epitaxy Systems
Induction-Heated Epitaxy
Third-Generation Semiconductors
t
Product Description
ZLD-SiC-8 SiC Epitaxy CVD is purpose-built to satisfy the next-generation power electronics and rail transit demand for premium SiC epitaxial layers. Its innovative hot-wall induction heating and multi-gas mixing system ensures highly uniform epitaxy and exceptional doping control while remaining compatible with 6- and 8-inch wafers. Engineered for high output, this system significantly enhances throughput and reduces total cost of ownership, making it an ideal core platform for third-generation semiconductor manufacturing.
Specification
Hot-wall induction heating architecture ensures a uniform thermal profile
Superior product specifications translate into improved device performance
Multiple gas-mixing mechanisms accommodate diverse process requirements
High throughput and low production cost maximize return on investment
Application
Power electronics sector: new energy vehicles (NEVs), DC charging stations, solar PV power generation, wind power generation, and more.
Rail transit sector: traction converter systems, among others.
Other sectors: large-scale servers, data centers, defense, aerospace, industrial control, and more.
RELATED PRODUCTS
ZLD-DC-4 Diamond Microwave Plasma CVD
ZLD-DC-4 Diamond Microwave Plasma CVD systems are core equipment for advancing fourth-generation wide-bandgap semiconductors, committed to achieving extreme growth of high-quality single-crystal and polycrystalline diamond films. Purpose-built to overcome thermal management bottlenecks in high-power chips, this system delivers an ultimate heat-sink solution for next-generation high-frequency, high-power devices while enabling frontier exploration of diamond semiconductor materials.
Learn More
ZLD-PW-1000 enables uniform and precisely controlled ALD or MLD on micro-nano powders, featuring patented powder containers, dynamic powder fluidization mechanisms, fully automated temperature control. The capacity is up to 100 g/1000 g.
Learn More
ZLD-IP-500 Industrial Powder ALD
The ZLD-IP-500 Industrial Powder ALD System brings atomic-level precision coating to 500 kg-scale mass production. Its exceptional uniformity (1σ < 3%) and patented sealing technology provide dependable surface functionalization solutions for lithium battery materials, catalysts, and metal powders—directly enhancing product consistency, service life, and performance. It is the ultimate platform for achieving high-performance powder materials.
Learn More
ZLD-TB-3 Thermal Batch ALD (Multi-Chamber)
ZLD Technology’s ZLD-TB-3 Thermal Batch ALD (Multi-Chamber)) system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.
Learn More
ZLD-PB-300E Plasma Batch ALD (EFEM)
ZLD-PB-300E Plasma Batch ALD (EFEM) enables low-temperature, high-quality PEALD processing, allowing premium optical films—such as SiO2, Al2O3, and TiO2—to be deposited onto temperature-sensitive substrates. It can also grow a variety of ALD films on bases made of glass, silicon wafers, ceramics, organic materials, polymers, metals, and other materials.
Learn More
ZLD-SP-4MG Multi-Chamber UHV Magnetron Sputter
ZLD-SP-4MG can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials. It supports Magnetron Sputtering for ITO Film and Seed Layer Based Process.
Learn More
ZLD-PB-350 Plasma Batch ALD realises low temperature, high quality plasma-enhanced ALD processes for high-quality thin film deposition (e.g., SiO₂, Al₂O₃, TiO₂) on various substrates, including lens, glass, organic materials, polymers, metals, and ceramics.
Learn More
ZLD-DP-6 Double-sided coated PEALD
ZLD-DP-6 adopts an exclusive design for double‑sided coating, enabling simultaneous and uniform deposition on both sides of the sample without the need for secondary flipping. This greatly improves production efficiency and film uniformity, making it suitable for high‑end applications with strict requirements on double‑sided film performance.It is also equipped with a fully automatic wafer handling system, realizing unmanned sample transfer throughout the process. This not only enhances operational efficiency but also fundamentally eliminates contamination risks caused by manual handling.
Learn More
Hot-wall induction heating architecture ensures a uniform thermal profile
Superior product specifications translate into improved device performance
Multiple gas-mixing mechanisms accommodate diverse process requirements
High throughput and low production cost maximize return on investment