Semiconductor Fabrication

Share:

Atomic Layer Deposition (ALD) is a precision thin-film deposition technology widely used in advanced device fabrication. From semiconductor devices to supercapacitors, microdevices, MEMS, nanoscale devices, and integrated circuits, ALD provides uniform, conformal coatings that enhance performance, reliability, and manufacturing precision.

ZLD independently developed CVD systems—including SiC epitaxial CVD, diamond MPCVD, and PECVD—serve the third-generation, fourth-generation , and silicon-based integrated circuit semiconductor markets. Leveraging 20+ proprietary core patents, Yunmao has established technological barriers in key process module innovation, reaction chamber flow field design and in-situ monitoring systems. 


These advancements deliver exceptional performance and stability for high-frequency devices, power electronics, MEMS sensors and Memory chips. As the global semiconductor industry shifts toward wide-bandgap materials, Yunmao strengthens strategic collaborations with industry leaders, accelerating the industrialization of next-gen semiconductor materials and devices through customized equipment solutions.



Semiconductor Fabrication


Other Applications

ALD & UHV SYSTEM

4 Chamber UHV Evaporator

4 Chamber UHV Evaporator

Plasma Batch PEALD

Plasma Batch PEALD

Multi-Chamber UHV Magnetron Sputter

Multi-Chamber UHV Magnetron Sputter

Desktop ALD

Desktop ALD

Thermal Batch ALD

Thermal Batch ALD

Powder ALD

Powder ALD
Contact Us
Home Tel E-mail