Why ALD is well-suited for optoelectronics

Atomic-level control: ALD's self-limiting surface reactions allow for precise control over film thickness, down to a single atomic layer.

Uniformity: It provides highly uniform film thickness over large areas and on complex geometries, which is essential for consistent device performance.

Conformality: ALD deposits uniform films conformally on virtually any surface, including complex and high-aspect-ratio structures, with no pinholes.

Low-temperature processing: ALD can deposit high-quality films at low temperatures, which allows for integration with temperature-sensitive materials like flexible substrates or organic compounds. 

Key Applications of ALD in optoelectronics

Protective and barrier layers: ALD creates dense, pinhole-free films that act as excellent barriers against moisture and oxygen, which is critical for the longevity of devices like flexible OLEDs and high-power LEDs.

Surface passivation: It can eliminate surface defects and dangling bonds, particularly in Quantum Dot (QD) devices, leading to higher photoluminescence efficiency and improved stability.

Antireflection and reflective coatings: ALD can be used to deposit coatings that improve the efficiency of light absorption or reflection in devices like solar cells and UV detectors.

Dielectric and functional films: ALD is used to create high-quality dielectric layers and other functional films needed in various optoelectronic components.

3D structures: The conformal nature of ALD allows it to deposit uniform films on and inside complex 3D architectures and high-aspect-ratio structures, which is essential for advanced devices like microLEDs and VCSELs.

Improved carrier transport: In some cases, ALD can improve carrier transport by filling interstitial spaces on a surface, leading to better performance in devices like QDs. 

For Mini/Micro LED Displays: ALD enhances optical performance by applying ultra-thin films that significantly improve light extraction efficiency, manage reflection, and stabilize color performance, all while increasing device durability.

For Passivation and Encapsulation: The technology provides the ultimate protection for complex components. It forms extremely uniform, pinhole-free barrier layers on high-aspect-ratio and 3D structures, ensuring complete coverage and long-term reliability.

For Integrated Circuits (ICs): In semiconductor fabrication, ALD is indispensable for depositing ultra-thin, high-quality films for critical features such as gate dielectrics and high-k insulating layers.

For MEMS Devices: ALD fabricates conformal functional and protective coatings on delicate micro-structures. The availability of plasma-enhanced ALD (PEALD) allows for low-temperature processing, safeguarding temperature-sensitive materials.

What We Provide

ZLD Technology's ALD systems are at the forefront of advancing optoelectronic devices, offering precise thin film deposition for applications in LED technology, photodetectors, and optical thin film coatings. Our solutions enable the development of high-performance devices with enhanced efficiency and reliability, meeting the growing demands of the optoelectronics industry.

ZLD's independently developed batch ALD and PEALD systems are designed for cutting-edge applications including Mini/Micro LED, advanced optics, and AR/VR. These systems achieve nanoscale thin-film deposition control while maintaining high-volume production capabilities, providing key technological support to overcome industry bottlenecks in both throughput and product performance. Taking the flagship batch plasma ALD system as an example, its proprietary multi-chamber synchronous deposition technology enables uniform film deposition with <1% thickness variation on complex substrates. Notably, in optical coating applications, the system has achieved a breakthrough in depositing ultra-low-reflectance (R<0.1%) optical films across the visible spectrum, reducing optical losses by over 60% compared to conventional methods. This innovation delivers a transformative process solution for mass-producing next-gen optical devices such as:

• High-definition imaging systems

• Reliable optics for extreme environments

• Diffractive waveguides

• Metalenses