ZLD's UHV thin film deposition systems provide an ultra-clean deposition environment with a base pressure of 10⁻⁹–10⁻¹¹ Torr, enabling the fabrication of high-quality thin films under precisely controlled conditions. 

ZLD UHV equipment platform includes PVD systems and ALD systems. These systems are widely used in superconducting electronic devices, optical micro/nano-devices, spintronic chips, 3D chip packaging, ferroelectric material-based chips, memory chips and energy storage devices. By integrating high-precision wafer motion control, advanced temperature regulation, and specialized vacuum chamber design, UHV systems achieve exceptional film uniformity, superior crystallinity and ultra-smooth surface morphology. This platform delivers advanced turnkey solutions for cutting-edge device fabrication across multiple fields.