Advanced Device
Quantum science and advanced device fabrication require strict control over thin-film properties, including thickness accuracy, material purity, and interface quality. Magnetron sputtering and evaporator systems are widely used in this field because they can meet these technical requirements in a controlled and repeatable manner.
Accurate Control of Film Thickness and Uniformity
Quantum devices are sensitive to small variations in thin-film thickness and composition. Magnetron sputtering and evaporation processes allow precise adjustment of deposition rates, making it possible to form films with consistent thickness across the substrate. This level of control is important for maintaining stable electrical and physical properties in quantum-scale structures.
Deposition of High-Purity Thin Films
Many materials used in quantum and nanoscale devices require low impurity levels and clean interfaces. Thin films deposited under high-vacuum or ultra-high-vacuum conditions help limit contamination during the deposition process. As a result, the films exhibit reduced defect density and improved interface quality, which are critical for device reliability.
Support for Multilayer and Heterostructure Structures
Quantum and advanced electronic devices often consist of multiple functional layers, such as metal, dielectric, oxide, or compound films. Magnetron sputtering and evaporator systems support sequential deposition of different materials, allowing controlled fabrication of multilayer stacks and heterostructures with defined layer thickness and composition.
Stable and Repeatable Deposition Processes
Consistency between deposition runs is important for both material evaluation and device fabrication. These systems provide stable plasma conditions and controlled evaporation behavior, helping to maintain repeatable process parameters and comparable film properties across multiple samples.
Adjustable Process Parameters for Material Tuning
Thin-film properties such as conductivity, surface morphology, and crystallinity are influenced by parameters including power, temperature, pressure, and gas composition. Magnetron sputtering and evaporation systems allow these parameters to be adjusted within a controlled range, supporting material tuning for specific device requirements.
Compatibility with Research and Fabrication Environments
These deposition systems are commonly used in laboratory and cleanroom environments and can accommodate various substrate materials and sizes. They are suitable for integration with standard characterization and testing workflows used in quantum material and device development.
ZLD's UHV thin film deposition systems provide an ultra-clean deposition environment with a base pressure of 10⁻⁹–10⁻¹¹ Torr, enabling the fabrication of high-quality thin films under precisely controlled conditions.
ZLD UHV equipment platform includes PVD systems and ALD systems. These systems are widely used in superconducting electronic devices, optical micro/nano-devices, spintronic chips, 3D chip packaging, ferroelectric material-based chips, memory chips and energy storage devices. By integrating high-precision wafer motion control, advanced temperature regulation, and specialized vacuum chamber design, UHV systems achieve exceptional film uniformity, superior crystallinity and ultra-smooth surface morphology. This platform delivers advanced turnkey solutions for cutting-edge device fabrication across multiple fields.

Other Applications
ALD & UHV SYSTEM