English
English
Tags:
Advanced Optical Thin Films
Encapsulation Passivation Film
Semiconductor/Optoelectronic Devices
Plasma Batch ALD (EFEM)
ZLD-PB-300E Plasma Batch ALD (EFEM) enables low-temperature, high-quality PEALD processing, allowing premium optical films—such as SiO2, Al2O3, and TiO2—to be deposited onto temperature-sensitive substrates. It can also grow a variety of ALD films on bases made of glass, silicon wafers, ceramics, organic materials, polymers, metals, and other materials.
Product Description
ZLD-PB-300E Plasma Batch ALD (EFEM) supports low-temperature, high-quality PEALD, enabling high-grade optical films such as SiO₂, Al₂O₃, and TiO₂ to be deposited onto heat-sensitive substrates. It also allows various types of ALD films to be grown on substrates made of glass, silicon wafers, ceramics, organic materials, polymers, metals, and other materials.
Specification
Compatible with both 12-inch and 8-inch wafers
Optional EFEM module enables fully automated production
Supports both thermal ALD and plasma-enhanced ALD (PEALD) processes
Fully automated, multi-wafer, high-volume production with industry-leading throughput
Application
1. Advanced Optical Thin Films
2. Encapsulation Passivation Film
3. Semiconductor/Optoelectronic Devices
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12-inch batch non-uniformity < 1.5%
Batch-to-batch non-uniformity < 1.0%