CLASSIFICATION

ZLD-IP-500 Industrial Powder ALD

Tags:

Industrial ALD

Powder ALD

Powder Coating Equipment

Powder Atomic Layer Deposition

Lithium Battery Coating

Catalyst Coating

Anti-Oxidation for Metal Powders

Atomic-Level Thickness Control

Powder Surface Modification

Moisture-Barrier and Anti-Oxidation Coating

The ZLD-IP-500 Industrial Powder ALD System brings atomic-level precision coating to 500 kg-scale mass production. Its exceptional uniformity (1σ < 3%) and patented sealing technology provide dependable surface functionalization solutions for lithium battery materials, catalysts, and metal powders—directly enhancing product consistency, service life, and performance. It is the ultimate platform for achieving high-performance powder materials.

Share:

Product Description

The ZLD-IP-500 Industrial Powder ALD System brings atomic-level precision coating to 500 kg-scale mass production. Its exceptional uniformity (1σ < 3%) and patented sealing technology provide dependable surface functionalization solutions for lithium battery materials, catalysts, and metal powders—directly enhancing product consistency, service life, and performance. It is the ultimate platform for achieving high-performance powder materials.

Specification

  • Maximum sample load capacity: 500 kg

  • Uniformity and batch-to-batch stability: 1σ < 3%

  • Configurable with 3–5 precursor sources to support a wide range of coating types

  • Multi-valve manifold design enables optimal precursor delivery control, ensuring repeatability and easy maintenance

  • Vertical powder lifting and dispersion, combined with a specialized gas injection scheme, ensures thorough contact between powder and precursors, effectively improving coating uniformity

  • Patented high-temperature vacuum rotary sealing device maintains vacuum sealing under powder dispersion conditions, ensuring process stability


Application

  1.  Lithium-Ion Battery (Li-ion Battery)

  2. Powder ALD coating for metal powders, alloy powders, catalysts, phosphors, diamond, and other powders.

RELATED PRODUCTS

ZLD-TB-3 Thermal Batch ALD (Multi-Chamber)

ZLD-TB-3 Thermal Batch ALD (Multi-Chamber)

ZLD Technology’s ZLD-TB-3 Thermal Batch ALD (Multi-Chamber)) system leverages advanced Thermal Atomic Layer Deposition technology to deliver high-precision thin film deposition for industrial applications.It is a dedicated themal ALD designed for 4/6-inch LED manufacturing lines, comprising process chamber, motion control system and load/unload platform.

Learn More
ZLD-CL-4DT 4 Chamber UHV Evaporator

ZLD-CL-4DT 4 Chamber UHV Evaporator

ZLD-CL-4DT includes four process chambers: load-lock (pre-treatment) chamber, ion milling chamber, evaporator, oxidation chamber. Specially designed manipulator allows tilting and rotation of wafer with little friction. Fully automatic operation guarantee reproducible results. QBT-J is the advanced solution to tunneling junction, optical structure, metal-insulator-metal structure, capacitor and so on.

Learn More
ZLD-DC-4 Diamond Microwave Plasma CVD

ZLD-DC-4 Diamond Microwave Plasma CVD

ZLD-DC-4 Diamond Microwave Plasma CVD systems are core equipment for advancing fourth-generation wide-bandgap semiconductors, committed to achieving extreme growth of high-quality single-crystal and polycrystalline diamond films. Purpose-built to overcome thermal management bottlenecks in high-power chips, this system delivers an ultimate heat-sink solution for next-generation high-frequency, high-power devices while enabling frontier exploration of diamond semiconductor materials.

Learn More
ZLD-SP-4MG Multi-Chamber UHV Magnetron Sputter

ZLD-SP-4MG Multi-Chamber UHV Magnetron Sputter

ZLD-SP-4MG can be optionally configured with multiple chambers, including one load-lock chamber and multiple sputtering chambers. It is the cutting edge vacuum system for novel materials. It supports Magnetron Sputtering for ITO Film and Seed Layer Based Process.

Learn More
ZLD-PB-300E Plasma Batch ALD (EFEM)

ZLD-PB-300E Plasma Batch ALD (EFEM)

ZLD-PB-300E Plasma Batch ALD (EFEM) enables low-temperature, high-quality PEALD processing, allowing premium optical films—such as SiO2, Al2O3, and TiO2—to be deposited onto temperature-sensitive substrates. It can also grow a variety of ALD films on bases made of glass, silicon wafers, ceramics, organic materials, polymers, metals, and other materials.

Learn More
ZLD-ALD-12CL 8"/12" ALD Cluster System

ZLD-ALD-12CL 8"/12" ALD Cluster System

ZLD-ALD-12CL balances both R&D and volume production requirements. It fully retains its mature and stable process performance, supports both thermal and plasma-enhanced (PE) modes, and consistently maintains its core advantage of low-oxygen thin-film deposition.

Learn More
ZLD-PB-350 Plasma Batch ALD

ZLD-PB-350 Plasma Batch ALD

ZLD-PB-350 Plasma Batch ALD realises low temperature, high quality plasma-enhanced ALD processes for high-quality thin film deposition (e.g., SiO₂, Al₂O₃, TiO₂) on various substrates, including lens, glass, organic materials, polymers, metals, and ceramics. 

Learn More
ZLD-SiC-8 SiC Epitaxy CVD

ZLD-SiC-8 SiC Epitaxy CVD

ZLD-SiC-8 SiC Epitaxy CVD is purpose-built to satisfy the next-generation power electronics and rail transit demand for premium SiC epitaxial layers. Its innovative hot-wall induction heating and multi-gas mixing system ensures highly uniform epitaxy and exceptional doping control while remaining compatible with 6- and 8-inch wafers. Engineered for high output, this system significantly enhances throughput and reduces total cost of ownership, making it an ideal core platform for third-generation semiconductor manufacturing.

Learn More
Contact Us
Home Tel E-mail